256Jet-S Printhead
Inkjet Technology for PV Cell Manufacturing Enables Increased Efficiency & Decreased Cost
The Trident 256Jet-S industrial printhead can be used as part of a hybrid solution combining inkjet with either screen printing or electroplating. The 256Jet-S was specifically designed for solar applications and features stainless steel construction to provide the required chemical inertness to jet the typically aggressive solar materials. The printhead has a unique repairable design that sets it apart from disposable inkjet technologies and graphic printheads that have been adapted to solar applications. The 256Jet-S was been specifically designed to deliver consistent performance in the deposition of aggressive solar process fluids such as acidic dopants and alkaline etchants.
Features:
- Industry-Leading Durability
- Etch Precise, Narrow Features
- Enhanced Cell Efficiency
- Reduced Wafer Scrap
- Expanding Applications
Industry-Leading Durability
The Trident 256Jet-S industrial printhead features stainless steel construction for chemical inertness and a unique repairable design – that allows the nozzle plate to be disassembled, ultrasonically cleaned and reassembled. These features allow the 256Jet-S printhead to last up to 5 times longer than alternative inkjet printheads.
Etch Precise, Narrow 50 Micron Features
Together, the 256Jet-S printhead and VersaEtch Etchant/n-Dopant have deomnstrated capability to etch precise 50 micron features.
Enhanced Cell Efficiency
Used with the VersaEtchTM Etchant/n-Dopant, the 256Jet-S can match the enhanced cell efficienty (0.5%-1.0%) of other selective emitter approaches
Reduced Wafer Scrap
As a non-contact process, use of the 256Jet-S can result in up to a 10x reduction in costly wafer scrap compared to the use of contact selective emitter processes such as screen etching or laser etching. Scrap rates currently range from 0.5-1.0% and can be reduced to as alow as 0.1%
Expanding Applications
While the use of the Trident 256Jet-S printhead to deposit the VersaEtch Etchant/n-Dopant for front solar contacts has been demonstrated, additional applications are also in development in order to maximize the value of your ink jet tool investment. These include crystalline silicon applications such as jetting palladium as a seed layer and thin
film applications like the jetting of alkaline etch. Trident is also developing an application for inkjet deposition of a diffusion barrier for either crystalline silicon or thin film applications.
Download PDF
256Jet-S Printhead
Inkjet Technology for PV Cell Manufacturing Enables Increased Efficiency & Decreased Cost
The Trident 256Jet-S industrial printhead can be used as part of a hybrid solution combining inkjet with either screen printing or electroplating. The 256Jet-S was specifically designed for solar applications and features stainless steel construction to provide the required chemical inertness to jet the typically aggressive solar materials. The printhead has a unique repairable design that sets it apart from disposable inkjet technologies and graphic printheads that have been adapted to solar applications. The 256Jet-S was been specifically designed to deliver consistent performance in the deposition of aggressive solar process fluids such as acidic dopants and alkaline etchants.
Features:
- Industry-Leading Durability
- Etch Precise, Narrow Features
- Enhanced Cell Efficiency
- Reduced Wafer Scrap
- Expanding Applications
Industry-Leading Durability
The Trident 256Jet-S industrial printhead features stainless steel construction for chemical inertness and a unique repairable design – that allows the nozzle plate to be disassembled, ultrasonically cleaned and reassembled. These features allow the 256Jet-S printhead to last up to 5 times longer than alternative inkjet printheads.
Etch Precise, Narrow 50 Micron Features
Together, the 256Jet-S printhead and VersaEtch Etchant/n-Dopant have deomnstrated capability to etch precise 50 micron features.
Enhanced Cell Efficiency
Used with the VersaEtchTM Etchant/n-Dopant, the 256Jet-S can match the enhanced cell efficienty (0.5%-1.0%) of other selective emitter approaches
Reduced Wafer Scrap
As a non-contact process, use of the 256Jet-S can result in up to a 10x reduction in costly wafer scrap compared to the use of contact selective emitter processes such as screen etching or laser etching. Scrap rates currently range from 0.5-1.0% and can be reduced to as alow as 0.1%
Expanding Applications
While the use of the Trident 256Jet-S printhead to deposit the VersaEtch Etchant/n-Dopant for front solar contacts has been demonstrated, additional applications are also in development in order to maximize the value of your ink jet tool investment. These include crystalline silicon applications such as jetting palladium as a seed layer and thin
film applications like the jetting of alkaline etch. Trident is also developing an application for inkjet deposition of a diffusion barrier for either crystalline silicon or thin film applications.
Download PDF